ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) to achieve optimal thermal performance. The thermal pad should be connected to a solid ground plane on the bottom layer of the PCB.
ROHM recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The device should be placed on a solder land with a minimum size of 1.2mm x 1.2mm. A solder paste with a melting point of 217°C (423°F) or higher is recommended.
Although the datasheet specifies an absolute maximum rating of 6V, ROHM recommends limiting the input voltage to 5.5V to ensure reliable operation and prevent damage to the device.
ROHM recommends using an ESD protection device, such as a TVS diode, on the input lines to protect the DTA013ZMT2L from electrostatic discharge. The ESD protection device should be capable of withstanding at least ±2kV according to the IEC61000-4-2 standard.
Although the datasheet specifies an operating temperature range of -40°C to 125°C, ROHM recommends operating the device within a range of -20°C to 85°C for optimal performance and reliability.
DTA013ZMT2L datasheet
by ROHM Semiconductor
