The recommended PCB footprint for the DZ2S150M0L is a rectangular pad with dimensions of 3.5mm x 2.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the DZ2S150M0L is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
Yes, the DZ2S150M0L is designed to withstand high-vibration environments, with a vibration resistance of 10G (10-2000Hz) and a shock resistance of 100G (11ms).
Handle the DZ2S150M0L in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the component's pins or leads.
