Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the thermal derating curve provided in the datasheet. Additionally, ensure good airflow and thermal conduction to the PCB.
Texas Instruments recommends using X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for the input and output capacitors. The capacitor's ESR should be less than 100mΩ to ensure stable operation.
To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors for correctness. Ensure that the output voltage is within the specified range and that the feedback resistors are properly connected.
Texas Instruments recommends a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a reflow soldering process with a nitrogen atmosphere to prevent oxidation.