The recommended land pattern for EMI0805R-600 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
Yes, EMI0805R-600 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
EMI0805R-600 is designed for high-frequency applications, with a self-resonant frequency of 1.2 GHz. It exhibits low equivalent series resistance (ESR) and equivalent series inductance (ESL), making it suitable for high-frequency filtering and decoupling applications.
Yes, EMI0805R-600 is compatible with lead-free soldering processes, including RoHS and WEEE compliant processes. The component is designed to withstand the higher temperatures associated with lead-free soldering.
The typical tolerance for the inductance value of EMI0805R-600 is ±10%. This means that the actual inductance value may vary by up to 10% from the nominal value specified in the datasheet.
EMI0805R-600 datasheet
by API Delevan
