ESH2DH datasheet by Taiwan Semiconductor

ESH2DH Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern on the PCB are also suggested.
• How do I ensure reliable operation in high-temperature environments?
  Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Also, ensure the device is operated within the recommended voltage and current ranges.
• What are the ESD protection measures for the ESH2DH?
  The ESH2DH has built-in ESD protection diodes on all pins, which can withstand up to 2kV HBM and 100V MM. However, additional external ESD protection devices may be necessary depending on the application and environment.
• Can I use the ESH2DH in a high-frequency switching application?
  Yes, the ESH2DH is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is operated within the recommended voltage and current ranges, and that the PCB layout is optimized for high-frequency operation.
• How do I handle the power sequencing requirements for the ESH2DH?
  The ESH2DH requires a specific power sequencing order to prevent damage. Ensure that the VCC pin is powered up before the VIN pin, and that the VCC pin is powered down after the VIN pin.