FLC21-135A datasheet by STMicroelectronics

FLC21-135A Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
• How do I ensure reliable operation in high-temperature environments?
  To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to use a suitable thermal management system.
• What is the recommended soldering profile for this device?
  STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s to prevent thermal shock and ensure reliable solder joints.
• Can I use this device in a high-humidity environment?
  Yes, the FLC21-135A is designed to operate in humid environments, but it is recommended to follow proper moisture-sensitive device handling and storage procedures to prevent damage.
• How do I troubleshoot issues with the device's output voltage regulation?
  To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback network for proper configuration and operation. Also, verify that the device is operating within its specified temperature range and that the PCB layout is optimized for thermal performance.