The recommended PCB layout for optimal thermal performance of the FM2000W-W includes a thermal pad on the bottom of the device, a solid copper plane on the PCB, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure the reliability of the FM2000W-W in high-temperature applications, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, a heat sink or thermal interface material can be used to improve heat dissipation.
The maximum surge current that the FM2000W-W can withstand is not explicitly stated in the datasheet. However, according to Rectron Semiconductor's application notes, the device can withstand a surge current of up to 10 times the rated current for a duration of 10ms.
Yes, the FM2000W-W can be used in parallel to increase the current rating. However, it is recommended to ensure that the devices are matched in terms of their electrical characteristics and that the PCB layout is designed to minimize current imbalance between the devices.
The recommended storage condition for the FM2000W-W is to store the devices in a dry, cool place with a relative humidity of less than 60%. It is also recommended to store the devices in their original packaging or in a moisture-proof bag to prevent moisture absorption.
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