FR1003GP-TP datasheet by Micro Commercial Components

FR1003GP-TP Frequently Asked Questions (FAQs)

• What is the recommended land pattern for FR1003GP-TP?
  The recommended land pattern for FR1003GP-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
• How do I handle the thermal pad of FR1003GP-TP during PCB assembly?
  The thermal pad of FR1003GP-TP should be connected to a copper plane on the PCB to dissipate heat efficiently. It's recommended to use a thermal interface material (TIM) between the thermal pad and the copper plane to reduce thermal resistance.
• What is the maximum operating temperature range for FR1003GP-TP?
  The maximum operating temperature range for FR1003GP-TP is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
• Can I use FR1003GP-TP in a high-vibration environment?
  Yes, FR1003GP-TP is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to follow proper PCB design and assembly guidelines to ensure the device's reliability in high-vibration environments.
• How do I ensure the reliability of FR1003GP-TP in high-humidity environments?
  To ensure the reliability of FR1003GP-TP in high-humidity environments, it's recommended to follow proper PCB design and assembly guidelines, including the use of moisture-resistant materials and conformal coating. Additionally, the device should be stored in a dry environment before assembly and soldering.