The recommended PCB footprint for the GBJ1502-BP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
Yes, the GBJ1502-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the PCB and surrounding components can withstand the elevated temperatures.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste or flux to the pads. Use a gentle touch and avoid applying excessive pressure, which can damage the device.
Yes, the GBJ1502-BP is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature range to ensure reliable joints.
The typical power dissipation of the GBJ1502-BP is around 1.5W, but this can vary depending on the specific application and operating conditions. It's essential to ensure that the device is properly heat-sinked and that the PCB is designed to handle the expected power dissipation.
GBJ1502-BP datasheet
by Micro Commercial Components
