A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Keep the thermal path short and use multiple vias to reduce thermal resistance.
Derate the device's current rating according to the temperature derating curve in the datasheet. Ensure good airflow and consider using a heat sink if operating near the maximum temperature rating.
Exceeding the maximum surge current rating can lead to overheating, reduced lifespan, or even catastrophic failure. Ensure that the device is properly sized for the application's surge current requirements.
Yes, but ensure that the device is properly snubbed to prevent voltage spikes and ringing. A snubber circuit can help reduce electromagnetic interference (EMI) and prevent device damage.
Use a reverse polarity protection diode or a voltage clamp circuit to prevent reverse voltage from damaging the device.
GBU8M-BP datasheet
by Micro Commercial Components
