A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a decoupling capacitor (e.g., 10uF) close to the VCC pin.
Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.
The maximum allowed voltage on the input pins is VCC + 0.5V. Exceeding this voltage may damage the device.
Use ESD protection devices (e.g., TVS diodes or ESD arrays) on the input lines. Ensure the ESD protection devices are rated for the maximum voltage and current of the application.
Power up the device in the following sequence: VCC, then input signals. Power down in the reverse sequence: input signals, then VCC.