The recommended soldering temperature is 260°C (500°F) for 10 seconds, with a peak temperature of 240°C (464°F) for 5 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
To ensure reliability in high-temperature applications, it's crucial to follow the recommended operating temperature range of -40°C to 100°C (-40°F to 212°F). Additionally, consider derating the device's current and voltage ratings according to the temperature derating curve provided in the datasheet.
The typical lead time for delivery of the H11AA1XSM varies depending on the quantity and availability. However, Isocom Components typically quotes a lead time of 6-12 weeks for standard orders. It's best to check with the supplier or distributor for the most up-to-date lead time information.
Yes, the H11AA1XSM is a sensitive electronic component and requires proper handling and storage. It's essential to store the devices in a dry, clean environment, away from direct sunlight and moisture. Avoid touching the pins or leads to prevent electrostatic discharge (ESD) damage.
The H11AA1XSM is designed to withstand moderate vibration levels. However, it's essential to ensure that the device is properly mounted and secured to prevent mechanical stress. If the application involves extreme vibration, it's recommended to consult with Isocom Components or a qualified engineer to determine the suitability of the device.
