H8601VBBB datasheet by Arcolectric

H8601VBBB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Arcolectric recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2 oz copper thickness. A thermal via array under the device can also improve heat dissipation.
• How do I ensure reliable operation in high-humidity environments?
  Arcolectric recommends conformal coating the device and PCB to protect against moisture. Additionally, ensure the device is stored in a dry environment and handled with ESD precautions.
• What is the maximum allowable voltage transient on the input pins?
  Arcolectric recommends limiting voltage transients to 10% of the rated input voltage to prevent damage to the device. Exceeding this limit may cause permanent damage or affect reliability.
• Can I use the H8601VBBB in a parallel configuration to increase output current?
  Yes, the H8601VBBB can be paralleled to increase output current. However, Arcolectric recommends ensuring that the devices are matched in terms of output voltage and current to prevent uneven current sharing.
• What is the recommended input capacitor type and value for optimal performance?
  Arcolectric recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the input voltage and frequency. This helps to reduce input ripple and improve overall performance.