A 4-layer PCB with a dedicated thermal layer and thermal vias is recommended. Ensure a solid ground plane and minimize thermal resistance between the device and heat sink.
Use a low-ESR capacitor (e.g., 10uF, 1.5V) close to the device's power pins. Ensure a stable 1.2V supply with minimal ripple (<10mV) and a high-quality, low-dropout regulator.
Use a single, low-jitter clock source (e.g., 25MHz) and ensure a stable clock signal with minimal skew (<100ps) between clock inputs.
Use controlled impedance traces (e.g., 50Ω) and ensure signal integrity by minimizing reflections, crosstalk, and electromagnetic interference (EMI).
Consult the Broadcom Limited application note AN1234 for BIST configuration and usage guidelines. Ensure proper BIST initialization and execution to avoid device malfunction.
