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    HEDS-9711-150 datasheet by Avago Technologies

    • Small Optical Encoder Modules
    • Original
    • Yes
    • Yes
    • Active
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    HEDS-9711-150 datasheet preview

    HEDS-9711-150 Frequently Asked Questions (FAQs)

    • Broadcom recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the package to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
    • Use a precision alignment tool or a fixture to ensure the optical axis of the encoder is perpendicular to the PCB. Apply a small amount of adhesive to secure the encoder in place during assembly.
    • Use a soft, dry brush or a lint-free cloth to gently remove any debris or contaminants from the optical components. Avoid using chemicals, ultrasonic cleaning, or high-pressure air, as they may damage the components.
    • Use ESD-safe materials, such as ESD-safe trays, bags, and wrist straps, to prevent electrostatic discharge damage. Ensure that all personnel handling the devices are grounded and follow proper ESD handling procedures.
    • Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures (above 40°C or below -20°C). Avoid exposing the devices to mechanical stress, vibration, or shock during shipping.
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