HN1C01FU-Y,LF datasheet by Toshiba America Electronic Components

HN1C01FU-Y,LF Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the HN1C01FU-Y,LF?
  The recommended PCB footprint for the HN1C01FU-Y,LF is a 2.5mm x 1.8mm pad with a 0.5mm radius corner, and a 0.3mm via hole for thermal relief.
• How do I ensure reliable soldering of the HN1C01FU-Y,LF?
  To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Avoid applying excessive force or pressure during soldering.
• What is the maximum operating temperature range for the HN1C01FU-Y,LF?
  The maximum operating temperature range for the HN1C01FU-Y,LF is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
• How do I handle the HN1C01FU-Y,LF for optimal ESD protection?
  Handle the HN1C01FU-Y,LF in an ESD-protected environment, using ESD-safe materials and tools. Ground yourself by wearing an ESD strap or using an ESD mat to prevent static electricity damage.
• What is the recommended reflow soldering profile for the HN1C01FU-Y,LF?
  The recommended reflow soldering profile for the HN1C01FU-Y,LF is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.