A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The HR1000AGS-Z has an exposed thermal pad, so a thermal relief pattern on the PCB is necessary to ensure good thermal conductivity.
Ensure good airflow around the device, and consider using a heat sink or thermal interface material to improve heat transfer. The device's thermal pad should be soldered to a solid ground plane or a thermal relief pattern on the PCB.
The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal reliability and performance.
The HR1000AGS-Z is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure proper cooling and consider derating the device's output current at high temperatures.
Check the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Verify the PCB layout and thermal design are correct. Use an oscilloscope to check for oscillations or noise on the output.
