Broadcom recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.
To optimize performance, ensure that the PCB trace impedance is matched to the HSML-C170's output impedance (typically 50 ohms). Use a high-quality, low-loss PCB material and minimize trace lengths and discontinuities.
Decouple the power supply with a 10uF capacitor in parallel with a 100nF capacitor, placed as close to the HSML-C170 as possible. Add a ferrite bead or a pi-filter to reduce noise and EMI.
Use a high-speed oscilloscope to analyze signal integrity and a spectrum analyzer to identify power supply noise. Check for proper PCB layout, decoupling, and filtering. Consult Broadcom's application notes and technical support for further assistance.
The HSML-C170 has a built-in thermal shutdown feature that disables the device when the junction temperature exceeds 150°C. It also has an overcurrent protection feature that limits the output current to prevent damage.
