Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.
To minimize power consumption, operate the device at the lowest possible frequency, use the power-down mode when not in use, and optimize the voltage regulator module (VRM) design to minimize power losses.
The recommended settings for the internal voltage regulators are: VCC_CORE = 1.2V, VCC_IO = 1.8V, and VCC_AUX = 2.5V. These settings can be adjusted based on the specific application requirements.
Use a logic analyzer or oscilloscope to capture signals, check the device's power-on reset (POR) and brown-out detector (BOD) settings, and verify the clock signal integrity. Consult the datasheet and application notes for specific troubleshooting guidelines.
The device has a maximum junction temperature (TJ) of 125°C. Ensure good thermal conductivity between the package and the PCB, and use thermal interface materials (TIMs) to minimize thermal resistance.
HSMP-3820-BLKG datasheet
by Avago Technologies
