HSMP-3820-TR1 datasheet by Avago Technologies

HSMP-3820-TR1 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for HSMP-3820-TR1?
  The recommended PCB layout and thermal management for HSMP-3820-TR1 can be found in the Broadcom application note AN2351, which provides guidelines for PCB design, thermal management, and assembly.
• How do I optimize the performance of HSMP-3820-TR1 in my specific application?
  To optimize the performance of HSMP-3820-TR1, it is recommended to consult with Broadcom's application engineers, who can provide customized guidance based on the specific application requirements and use case.
• What are the reliability and qualification tests that HSMP-3820-TR1 has undergone?
  HSMP-3820-TR1 has undergone rigorous reliability and qualification tests, including temperature cycling, humidity testing, and mechanical stress testing, as outlined in the Broadcom reliability report.
• Can I use HSMP-3820-TR1 in a non-Wi-Fi application?
  While HSMP-3820-TR1 is primarily designed for Wi-Fi applications, it can be used in other non-Wi-Fi applications with proper evaluation and testing. However, it is recommended to consult with Broadcom's application engineers to ensure the device meets the specific application requirements.
• What is the lead time and availability of HSMP-3820-TR1?
  The lead time and availability of HSMP-3820-TR1 can vary depending on the region and distributor. It is recommended to check with authorized distributors or Broadcom's sales team for the latest information on lead time and availability.