HTRC11001T/02EE datasheet by NXP Semiconductors

HTRC11001T/02EE Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the HTRC11001T/02EE?
  A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching to minimize signal reflections.
• How do I ensure reliable communication between the HTRC11001T/02EE and the host microcontroller?
  Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency and data transmission rates are within the specified limits. Also, use a pull-up resistor on the data lines to prevent signal degradation.
• What is the maximum operating temperature range for the HTRC11001T/02EE?
  The HTRC11001T/02EE can operate from -40°C to +125°C, but the optimal operating temperature range is between 0°C to 85°C for reliable performance.
• How do I handle the power-on reset (POR) and brown-out detection (BOD) features of the HTRC11001T/02EE?
  The POR and BOD features are enabled by default. To disable them, tie the POR pin to VDD and the BOD pin to GND. However, it is recommended to use these features to ensure reliable system operation.
• What is the recommended antenna design for optimal RF performance with the HTRC11001T/02EE?
  A quarter-wavelength monopole antenna or a dipole antenna with a 50-ohm impedance matching network is recommended. The antenna should be designed to operate at the desired frequency band (e.g., 2.4 GHz for Bluetooth Low Energy).