The recommended land pattern for IDC5020ER4R7M can be found in the Vishay Intertechnologies' application note AN483, which provides guidelines for PCB layout and land pattern design.
The IDC5020ER4R7M has a thermal resistance of 2.5°C/W, and it's recommended to use a thermal pad or a heat sink to improve heat dissipation. The application note AN483 also provides guidance on thermal management.
The IDC5020ER4R7M has an operating temperature range of -55°C to +150°C, but it's recommended to derate the power handling at higher temperatures to ensure reliability.
The IDC5020ER4R7M is designed for high-frequency applications up to 100 MHz, but it's recommended to evaluate the component's performance in the specific application and consider factors such as parasitic inductance and capacitance.
The recommended soldering profile for IDC5020ER4R7M is a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds. The application note AN483 provides more detailed guidance on soldering.
