Vishay provides a recommended PCB layout and land pattern in their application note AN10273, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and reliability.
The datasheet recommends using a thermal interface material (TIM) with a thermal conductivity of at least 3 W/m-K. Apply a thin, even layer of TIM to the die attach surface, and ensure the TIM is compatible with the device and PCB materials.
Vishay recommends derating the maximum voltage by 10% to ensure reliable operation. For example, if the maximum rated voltage is 680V, the derated voltage would be 612V (680V x 0.9).
Use the following formula to calculate power dissipation: Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current. Ensure the calculated power dissipation is within the device's rated power dissipation.
Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body or leads, avoiding touching the die attach surface or other sensitive areas.
