The recommended land pattern for IHLM2525CZER1R0M01 is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal management, ensure good thermal conductivity between the inductor and the PCB by using a thermal via or a thermal pad. Also, consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation.
The maximum operating temperature range for IHLM2525CZER1R0M01 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or a shock-absorbing mount.
The recommended soldering profile for IHLM2525CZER1R0M01 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
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