The recommended land pattern for the IHLP2020CZER3R3M01 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP2020CZER3R3M01 has a high current rating, so it's essential to ensure good thermal management. This can be achieved by providing a sufficient copper area on the PCB, using thermal vias, and applying a thermal interface material (TIM) between the inductor and the PCB.
The maximum operating temperature range for the IHLP2020CZER3R3M01 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
Yes, the IHLP2020CZER3R3M01 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
The IHLP2020CZER3R3M01 has a moisture sensitivity level (MSL) of 1, which means it can withstand a maximum of 30 days in a humidity-controlled environment before soldering.
