The recommended PCB footprint for the IHLP2525AHERR47M01 is a pad size of 2.5 mm x 2.5 mm with a 1.5 mm diameter hole in the center. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) connection to the via.
The IHLP2525AHERR47M01 has a maximum operating temperature of 125°C. To handle thermal derating, ensure that the inductor is operated within the recommended temperature range, and consider using a heat sink or thermal interface material to reduce the temperature rise.
The SRF of the IHLP2525AHERR47M01 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. Typically, the SRF is around 100-200 MHz for this inductor.
Yes, the IHLP2525AHERR47M01 is suitable for high-reliability applications. It is built with a robust construction and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the inductor's reliability in the application.
To ensure the saturation current rating is not exceeded, calculate the peak current through the inductor using the application's voltage and frequency. Compare this value to the inductor's saturation current rating (Isat) specified in the datasheet. Ensure that the peak current is below the Isat rating to prevent saturation.
