The recommended land pattern for the IHLP2525BDER3R3M01 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
To handle the high current rating of the IHLP2525BDER3R3M01, ensure that your PCB design includes wide enough traces and a sufficient number of vias to handle the current. Also, consider using a thermal relief pattern to reduce thermal resistance.
The derating curve for the IHLP2525BDER3R3M01 can be found in the datasheet, but in general, the inductor's current rating decreases as the ambient temperature increases. For example, at 125°C, the current rating is approximately 70% of the maximum rated current.
Yes, the IHLP2525BDER3R3M01 is suitable for high-frequency applications up to 1 MHz. However, be aware that the inductor's impedance and Q factor will change with frequency, so ensure that your design takes these effects into account.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
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