The recommended PCB footprint for the IHLP2525EZER100M01 is a pad size of 2.5 mm x 2.5 mm with a 1.5 mm diameter hole in the center for the inductor's lead.
The IHLP2525EZER100M01 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a heat sink or thermal pad if the inductor will be operating near its maximum temperature rating.
The IHLP2525EZER100M01 has a saturation current rating of 10.5 A. Exceeding this current may cause the inductor to saturate, reducing its inductance and potentially causing system instability.
Yes, the IHLP2525EZER100M01 is suitable for high-frequency applications up to 1 MHz. However, be aware that the inductor's impedance will increase with frequency, which may affect system performance.
Use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder to the inductor's leads. Ensure the solder flows smoothly and evenly around the lead, and avoid applying excessive heat or force, which can damage the inductor.
