The recommended land pattern for the IHLP3232CZER1R0M11 is a rectangular pad with a size of 3.2mm x 2.8mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP3232CZER1R0M11 has a high current rating, so it's essential to ensure good thermal management. This can be achieved by providing a sufficient copper area on the PCB, using thermal vias, and applying a thermal interface material (TIM) between the inductor and the PCB.
The maximum operating temperature range for the IHLP3232CZER1R0M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
To ensure the reliability of the IHLP3232CZER1R0M11 in high-vibration applications, it's recommended to use a secure mounting method, such as soldering or adhesive bonding, and to follow the recommended PCB layout and land pattern guidelines.
The equivalent series resistance (ESR) of the IHLP3232CZER1R0M11 is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ based on the inductor's design and materials.