The recommended PCB footprint for IHLP3232CZER8R2M01 is a rectangular pad with dimensions of 3.2mm x 2.8mm, with a 0.5mm x 0.5mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.2mm around the perimeter.
To ensure proper thermal management, it is recommended to provide a thermal path from the inductor to a heat sink or a large copper area on the PCB. The thermal pad on the inductor should be connected to a thermal via or a copper pour on the PCB, and the heat sink or copper area should be designed to dissipate the heat generated by the inductor.
The maximum operating temperature range for IHLP3232CZER8R2M01 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
Yes, IHLP3232CZER8R2M01 is compatible with lead-free soldering. The inductor is designed to withstand the higher temperatures associated with lead-free soldering processes.
The moisture sensitivity level (MSL) of IHLP3232CZER8R2M01 is MSL 1, which means it can withstand a maximum of 30 days at 30°C and 60% relative humidity before soldering.
