The recommended PCB footprint for the IHLP5050CEER100M01 is a pad size of 5.5 mm x 5.5 mm with a 1.5 mm hole in the center. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) connection to the via.
The thermal derating of the IHLP5050CEER100M01 should be handled by following the guidelines in the datasheet. The inductor's current rating decreases as the ambient temperature increases. For example, at 125°C, the current rating is 70% of the maximum current rating at 25°C.
The self-resonant frequency (SRF) of the IHLP5050CEER100M01 is not explicitly stated in the datasheet. However, it can be estimated using the inductor's inductance and capacitance values. Typically, the SRF of an inductor is around 10-20 times its operating frequency.
Yes, the IHLP5050CEER100M01 is suitable for high-reliability applications. It is built with a robust construction and has undergone rigorous testing to ensure its reliability. However, it is essential to follow proper design and manufacturing guidelines to ensure the inductor's reliability in the application.
The saturation current of the IHLP5050CEER100M01 can be determined by using the inductor's inductance and core material characteristics. A general rule of thumb is to use 70-80% of the inductor's maximum current rating as the saturation current. However, it is recommended to consult the datasheet and application notes for more specific guidance.
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