The recommended land pattern for IHLP5050FDER1R2M01 is a rectangular pad with a size of 5.5mm x 3.5mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While IHLP5050FDER1R2M01 has a rated operating temperature range of -40°C to +125°C, it's not recommended for high-temperature applications above 105°C due to potential degradation of the magnetic core and insulation. For high-temperature applications, consider using a high-temperature-rated inductor like IHLP5050FDER1R2M01-HT.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of solder bridging, such as using a soldering iron with a fine tip or using a hot air soldering technique.
While IHLP5050FDER1R2M01 is designed for high-current applications, it's not optimized for high-frequency applications above 1 MHz. For high-frequency applications, consider using a high-frequency-rated inductor like IHLP5050FDER1R2M01-HF, which has a lower equivalent series resistance (ESR) and inductance tolerance.
Store IHLP5050FDER1R2M01 in a dry, cool place away from direct sunlight and moisture. Handle the components by the body, avoiding touching the leads or pads to prevent damage or contamination. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
Findchips
Findchips