The recommended land pattern for ILSB0805ER2R2K is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While ILSB0805ER2R2K is rated for operation up to 150°C, it's essential to consider the derating of the component's power rating and reliability at high temperatures. Consult with a thermal expert or perform thermal simulations to ensure the component's safe operation in your specific application.
To prevent electrostatic discharge (ESD) damage, handle ILSB0805ER2R2K with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that your production line and storage facilities are ESD-safe, and follow proper handling and storage procedures.
The recommended soldering profile for ILSB0805ER2R2K is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. However, consult the datasheet and Vishay's application notes for more detailed information.
While ILSB0805ER2R2K is not hermetically sealed, it is designed to operate in a normal environment with a relative humidity of up to 60%. However, if your application involves high humidity or moisture, consider using a conformal coating or potting compound to protect the component.
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