The maximum power dissipation of the INA163UA/2K5 is 670mW at 25°C, but it can be derated to 500mW at 85°C.
To ensure stability, a capacitor (typically 10nF to 100nF) should be placed between the COMP and VIN- pins, and the gain resistors should be chosen to ensure a stable gain bandwidth product.
The INA163UA/2K5 should be placed close to the signal source, with the input pins (VIN+ and VIN-) connected to the signal source, and the output pin (VOUT) connected to the load. A ground plane should be used to minimize noise and interference.
To minimize EMI and RFI, use a shielded enclosure, keep the input and output traces short and away from noise sources, and use a common-mode choke or ferrite bead on the input lines.
The thermal resistance (θJA) of the INA163UA/2K5 is 125°C/W, which means that for every watt of power dissipation, the junction temperature will increase by 125°C.