Texas Instruments provides a recommended PCB layout in the application note SLVA879, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
The power consumption of INA271SKGD2 can be calculated using the formula: P = (VCC x ICC) + (VIN x IIN), where VCC is the supply voltage, ICC is the quiescent current, VIN is the input voltage, and IIN is the input current. The values for ICC and IIN can be found in the datasheet.
The maximum allowable input voltage for INA271SKGD2 is ±42V, but it's recommended to limit the input voltage to ±36V to ensure reliable operation and prevent damage to the device.
To ensure EMC with INA271SKGD2, follow proper PCB layout and design guidelines, use shielding and filtering techniques, and ensure that the device is properly decoupled from the power supply. Additionally, consider using a common-mode filter or a ferrite bead to reduce electromagnetic interference.
The thermal resistance of INA271SKGD2 is 34.4°C/W (junction-to-ambient) and 2.5°C/W (junction-to-case). High temperatures can affect the device's performance, accuracy, and reliability. Ensure proper thermal management by providing adequate heat sinking and airflow to keep the device within its recommended operating temperature range.