IR3477MTRPBF datasheet by International Rectifier

IR3477MTRPBF Frequently Asked Questions (FAQs)

• What is the thermal resistance of the IR3477MTRPBF?
  The thermal resistance of the IR3477MTRPBF is typically around 3.5°C/W (junction-to-case) and 60°C/W (junction-to-ambient) when mounted on a 1in² copper pad.
• Can I use the IR3477MTRPBF in a high-temperature environment?
  Yes, the IR3477MTRPBF is rated for operation up to 150°C, but the maximum junction temperature should not exceed 125°C for reliable operation.
• How do I ensure the IR3477MTRPBF is properly cooled?
  Proper cooling can be achieved by providing a sufficient heat sink, ensuring good thermal contact between the device and the heat sink, and using a thermal interface material (TIM) if necessary.
• What is the recommended PCB layout for the IR3477MTRPBF?
  A recommended PCB layout for the IR3477MTRPBF includes a solid ground plane, a separate power plane for the input and output, and a thermal relief pattern around the device to facilitate heat dissipation.
• Can I use the IR3477MTRPBF in a parallel configuration?
  Yes, the IR3477MTRPBF can be used in a parallel configuration to increase the output current capability, but it's essential to ensure that the devices are properly synchronized and matched to avoid uneven current sharing.