The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the device's thermal pad to the ground plane, and keeping the copper traces as short and wide as possible to minimize thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermally-enhanced package option if available.
The critical parameters to monitor during operation to prevent overheating include the device's junction temperature (TJ), input voltage, output current, and power dissipation. It's also essential to monitor the device's thermal shutdown threshold and overcurrent protection features.
Yes, the IR3802AMTRPBF can be used in a parallel configuration to increase output current, but it's essential to ensure that the devices are properly synchronized and matched to prevent current imbalance and oscillations. Additionally, the user should follow the recommended layout and thermal design guidelines to minimize thermal interactions between devices.
The recommended EMI filtering and shielding techniques for the IR3802AMTRPBF include using a common-mode choke, X-capacitors, and Y-capacitors to filter out electromagnetic interference. Additionally, consider using a shielded enclosure or a metal can package to reduce electromagnetic radiation.
IR3802AMTRPBF datasheet
by International Rectifier
