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    IRF530NS datasheet by International Rectifier

    • Power MOSFET(Vdss=100V, Rds(on)=0.11ohm, Id=17A)
    • Original
    • Transferred
    • EAR99
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    IRF530NS datasheet preview

    IRF530NS Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the IRF530NS is not explicitly stated in the datasheet, but it can be estimated based on the device's voltage and current ratings. As a general rule, it's recommended to operate the device within 20% of its maximum voltage and current ratings to ensure safe operation.
    • The junction-to-case thermal resistance (RθJC) for the IRF530NS is not explicitly stated in the datasheet, but it can be calculated using the thermal resistance values provided in the datasheet. RθJC can be estimated as RθJC = RθJA - RθCS, where RθJA is the junction-to-ambient thermal resistance and RθCS is the case-to-sink thermal resistance.
    • The recommended gate drive voltage for the IRF530NS is typically between 10V to 15V, depending on the application and the desired switching speed. However, it's essential to ensure that the gate drive voltage does not exceed the maximum gate-source voltage rating of 20V to prevent damage to the device.
    • Yes, the IRF530NS can be used in high-frequency switching applications, but it's essential to consider the device's switching characteristics, such as the rise and fall times, and the gate charge. The IRF530NS has a relatively high gate charge, which may limit its suitability for very high-frequency applications. Additionally, the device's parasitic capacitances and inductances should be considered to ensure stable operation.
    • To ensure proper cooling of the IRF530NS, it's essential to provide a good thermal path from the device to a heat sink or other cooling mechanism. This can be achieved by applying a thermal interface material (TIM) between the device and the heat sink, and ensuring that the heat sink is properly sized and cooled. The device's thermal resistance values, such as RθJA and RθJC, should be considered when designing the cooling system.
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