The maximum junction temperature of the IRFB4610PBF is 175°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 150°C for reliable operation and to prevent thermal runaway.
The thermal resistance of the IRFB4610PBF can be calculated using the thermal resistance values provided in the datasheet. The junction-to-case thermal resistance (RθJC) is 0.5°C/W, and the case-to-ambient thermal resistance (RθCA) depends on the heat sink and cooling conditions. You can use the following formula: RθJA = RθJC + RθCA.
The recommended gate drive voltage for the IRFB4610PBF is between 10V and 15V. A higher gate drive voltage can reduce the switching losses, but it may also increase the gate charge and oscillations. A lower gate drive voltage can reduce the gate charge, but it may also increase the switching losses.
To prevent shoot-through in a half-bridge configuration, you can use a dead-time control circuit to ensure that the high-side and low-side MOSFETs are not turned on simultaneously. You can also use a gate drive circuit with a built-in dead-time control or a dedicated dead-time control IC.
The maximum allowed dv/dt for the IRFB4610PBF is 50V/ns, as specified in the datasheet. Exceeding this value can cause the MOSFET to malfunction or fail. You can use a gate drive circuit with a built-in dv/dt control or add an external dv/dt filter to limit the voltage slew rate.