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    Part Img IRFR9N20D datasheet by International Rectifier

    • 200V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9N20D with Standard Packaging
    • Original
    • No
    • Unknown
    • Transferred
    • EAR99
    • Find it at Findchips.com

    IRFR9N20D datasheet preview

    IRFR9N20D Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the IRFR9N20D is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general rule, it's recommended to operate the device within the specified voltage and current ratings to ensure safe operation.
    • To calculate the junction temperature of the IRFR9N20D, you can use the following formula: Tj = Ta + (RθJA * Pd), where Tj is the junction temperature, Ta is the ambient temperature, RθJA is the thermal resistance from junction to ambient, and Pd is the power dissipation. The thermal resistance and power dissipation values can be found in the datasheet.
    • The recommended gate drive voltage for the IRFR9N20D is typically between 10V to 15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve switching performance, but may also increase power consumption and EMI.
    • Yes, the IRFR9N20D is suitable for high-frequency switching applications up to several hundred kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the gate drive circuitry is capable of providing a clean and stable signal.
    • To ensure proper cooling of the IRFR9N20D, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum expected power dissipation, and the TIM should have a low thermal resistance to minimize thermal impedance.
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