A good PCB layout for the IRS20957SPBF involves keeping the high-frequency switching nodes (e.g., drain-source voltage) as short as possible, using a solid ground plane, and minimizing the loop area of the high-current paths. A 2-layer or 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the maximum junction temperature (TJ) is not exceeded. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the device. Monitor the device's temperature using the thermal monitoring pin (VCC pin 5).
For EMI compliance, critical components to consider include the input filter, output filter, and PCB layout. Ensure that the input filter is designed to attenuate high-frequency noise, and the output filter is designed to reduce electromagnetic interference (EMI). A good PCB layout with a solid ground plane and minimal loop areas also helps to reduce EMI.
To optimize the gate drive circuit for minimum power loss, ensure that the gate drive voltage is set to the minimum required for reliable switching, and the gate drive resistance is minimized. Use a low-impedance gate drive circuit with a high-current capability, and consider using a gate drive transformer or a dedicated gate drive IC.
When paralleling multiple IRS20957SPBF devices, key considerations include ensuring that the devices are properly synchronized, the output inductors are properly coupled, and the current sharing is balanced. Use a master-slave configuration with a single clock signal, and ensure that the devices are properly heatsinked and thermally monitored.
IRS20957SPBF datasheet
by International Rectifier
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