A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, derate the device's power handling capability according to the temperature derating curve in the datasheet.
A gate drive circuit with a low impedance output, such as a dedicated gate driver IC or a discrete transistor-based circuit, is recommended. The circuit should be able to provide a peak current of at least 1A to ensure reliable switching.
Use a voltage clamp or a transient voltage suppressor (TVS) to protect against overvoltage. Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
A dead time of 100-200 ns is recommended to ensure proper switching and to prevent shoot-through currents. The exact dead time may vary depending on the specific application and switching frequency.