ISO7142CCQDBQRQ1 datasheet by Texas Instruments

ISO7142CCQDBQRQ1 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a ferrite bead or a 10uF capacitor to filter the power supply.
• How do I ensure electromagnetic compatibility (EMC) compliance?
  Use a shielded enclosure, keep the device away from high-frequency sources, and ensure proper grounding and bonding. Follow the guidelines in the TI application note 'EMC Compliance for Isolated Devices' (SLAA701).
• What is the maximum cable length for reliable data transmission?
  The maximum cable length depends on the data rate and cable quality. As a general guideline, use a cable length of up to 10 meters for data rates up to 100 Mbps, and up to 5 meters for data rates above 100 Mbps.
• How do I handle power-up and power-down sequencing?
  Power up the device in the following sequence: VCC, VISO, and then the input signals. Power down in the reverse sequence. Ensure a minimum of 10ms delay between power-up and signal application.
• What are the thermal management considerations?
  Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pads. Follow the thermal management guidelines in the TI application note 'Thermal Management for Isolated Devices' (SLAA702).