STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the IC to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended.
To ensure EMC, STMicroelectronics recommends following the guidelines in the application note AN2679, which provides guidance on PCB layout, component selection, and shielding. Additionally, the device should be placed in a shielded enclosure, and the PCB should be designed with a solid ground plane and a decoupling capacitor.
The L9959S-TR-D is rated for operation from -40°C to 150°C (junction temperature). However, the device can be operated up to 175°C with derating. It's essential to ensure proper thermal management to prevent overheating.
Yes, the L9959S-TR-D is designed to withstand high-vibration environments. However, it's essential to ensure the device is properly mounted and secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage.
STMicroelectronics recommends following a systematic troubleshooting approach, starting with verifying the power supply, checking for proper PCB layout and component selection, and using oscilloscope measurements to identify issues. The STMicroelectronics support team can also provide guidance and support.
L9959S-TR-D datasheet
by STMicroelectronics
