A good PCB layout is crucial for the LM4766T/LF15. TI recommends a layout with a star-ground configuration, keeping the power supply traces away from the signal traces, and using a large ground plane to reduce EMI. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
The output filter components (L, C, and R) should be chosen based on the desired cutoff frequency, output impedance, and power handling. TI provides a filter design tool and application notes to help with component selection. Additionally, the datasheet provides guidelines for selecting the output filter components.
The maximum power dissipation of the LM4766T/LF15 depends on the ambient temperature, package type, and heat sink used. TI recommends using a heat sink with a thermal resistance of less than 10°C/W to ensure reliable operation. The maximum power dissipation can be calculated using the thermal resistance and maximum junction temperature (Tj) of 150°C.
The LM4766T/LF15 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional protection can be added using external components such as voltage regulators, TVS diodes, and resistors to ensure reliable operation during power-up and power-down sequences.
The input coupling capacitor value depends on the input impedance, frequency response, and desired bass response. A value between 1uF to 10uF is typically recommended, with a higher value providing better bass response but increasing the risk of oscillation.
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