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    Part Img LM49450SQ/NOPB datasheet by Texas Instruments

    • LM49450 - I2C Inpt 2.5W/Ch Low EMI St Class D Sub-Sys w/ Gnd Ref Headph Amp, 3D Enhancement, & Headph Sns 32-WQFN -40 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.33.00.01
    • 8542.33.00.00
    • Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

    LM49450SQ/NOPB datasheet preview

    Datasheet Impression

    LM49450SQ/NOPB Price & Stock

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    DigiKey () 2,988 1
    • 1 $5.35
    • 10 $4.09
    • 100 $3.42
    • 1000 $3.16
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    2,988 1
    • 1 $5.35
    • 10 $4.09
    • 100 $3.42
    • 1000 $3.16
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    2,000 1,000
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    Mouser Electronics () 1,135
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    • 100 $3.43
    • 1000 $2.75
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    Verical 673 3
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    Arrow Electronics 673 6 Weeks 1
    • 1 $1.23
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    • 100 $1.17
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    Chip Stock 72,500
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    Win Source Electronics 60,000
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    • 10 $5.82
    • 100 $3.88
    • 1000 $3.88
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    LM49450SQ/NOPB Frequently Asked Questions (FAQs)

    • A good PCB layout practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the power traces away from the analog signals. Additionally, use a ferrite bead or a common-mode choke to filter the power supply lines.
    • To ensure proper power-up and power-down, follow the recommended power-up sequence: VCC, then AVCC, then DVCC. During power-down, reverse the sequence. Also, ensure that the voltage supplies are ramped up and down slowly to prevent inrush currents.
    • Use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins. This configuration helps to filter out high-frequency noise and ensures stable operation.
    • To minimize power consumption, use the lowest possible clock frequency, disable unused features, and use the power-down mode when not in use. Additionally, optimize the analog circuitry to minimize current consumption.
    • The LM49450SQ/NOPB has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended PCB layout and thermal design guidelines.
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