A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-3 layer board with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
To ensure proper biasing, connect the input voltage (VIN) to a stable voltage source, decouple the input with a 10uF capacitor, and connect the output voltage (VOUT) to a load with a minimum of 10uF capacitance.
The maximum output current capability of the LM95172EWG/NOPB is 3A, but it can be limited by the thermal performance of the PCB and the ambient temperature.
Use a voltage supervisor or a voltage monitor to detect overvoltage and undervoltage conditions, and implement a shutdown or reset mechanism to protect the device and the system.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor, as it provides a low equivalent series resistance (ESR) and a high ripple current rating.