A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-3 layer board with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
To ensure reliable operation in high-temperature environments, ensure that the device is properly heatsinked, use a thermal interface material (TIM) with a high thermal conductivity, and follow the recommended PCB layout guidelines.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range.
While the LM97593VH/NOPB is not hermetically sealed, it can still be used in high-humidity environments with proper precautions, such as conformal coating, potting, or using a moisture-resistant package.
To troubleshoot issues with the device's thermal performance, check for proper heatsinking, ensure that the thermal interface material is properly applied, and verify that the device is operating within the recommended temperature range.
LM97593VH/NOPB datasheet
by Texas Instruments
