A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
Monitor the input voltage, output voltage, and current to ensure they are within the specified ranges. Also, ensure the device is operated within the recommended temperature range of -40°C to 125°C.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin to minimize inductance.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure the PCB layout is optimized for minimal loop area and radiation.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VOUT pin to minimize inductance.