A good PCB layout for the LMH7322SQ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the device should be operated within its recommended operating conditions, and the input voltage should be well-regulated.
The maximum power dissipation of the LMH7322SQ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated based on the actual operating conditions.
The LMH7322SQ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and ensure proper heat sinking to maintain a safe operating temperature.
To troubleshoot issues with the LMH7322SQ, start by verifying the input voltage and current, and checking for any signs of overheating. Use an oscilloscope to check the output voltage and current waveforms. Also, ensure that the device is properly soldered and that there are no signs of physical damage.
LMH7322SQ/NOPB datasheet
by Texas Instruments
